Assistant Professor, Department of Biomedical Engineering, College of Future Technology, Peking University

Research Area: Bioelectronics, soft electronics, biomedical sensors, wearable/implantable sensors, MEMS, biomedical engineering

Award Citation: The AYSF Committee acknowledges his breakthrough contributions in the application of microelectromechanical systems (MEMS) to fabricate micro and nano-sensors, and would like to support his work on soft 3D deformable biosensors that promise to usher in the next generation of biosensors.

Bio: Mengdi Han is an Assistant Professor in the Department of Biomedical Engineering, College of Future Technology, Peking University. He received his B.S. degree in Huazhong University of Science and Technology in 2012 and Ph.D. degree in Peking University in 2017. He was a visiting Ph.D. student at Department of Materials Science and Engineering, University of Illinois Urbana-Champaign from 2015 to 2017. He worked as a postdoctoral fellow at Querrey Simpson Institute for Bioelectronics, Northwestern University from 2017 to 2020. His research group aims to develop advanced micromechanical bioelectronics for electronic skins, wireless biosensors and microrobotics. His research has been recognized with many awards including MIT Technology Review Innovators Under 35 Asia Pacific, Microsystems & Nanoengineering Young Scientist Award, and iCANX Young Scientist Award.

Personal Web: http://www.hmd-lab.com/